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Select item 90693711.

Biodegradable Elastomers and Gels for Elastic Electronics

Shuo Chen, Zekai Wu, Chengzhen Chu, Yufeng Ni, Rasoul Esmaeely Neisiany, Zhengwei You

Adv Sci (Weinh) 2022 May; 9(13): 2105146. Published online 2022 Feb 25. doi: 10.1002/advs.202105146

PMCID:: PMC9069371

Article PDF–11M

Select item 103050522.

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

Ratul Kumar Baruah, Hocheon Yoo, Eun Kwang Lee

Micromachines (Basel) 2023 Jun; 14(6): 1131. Published online 2023 May 27. doi: 10.3390/mi14061131

PMCID:: PMC10305052

Article PDF–4.4M

Select item 88951163.

A New Class of Electronic Devices Based on Flexible Porous Substrates

Yiyuan Zhang, Tengyuan Zhang, Zhandong Huang, Jun Yang

Adv Sci (Weinh) 2022 Mar; 9(7): 2105084. Published online 2022 Jan 17. doi: 10.1002/advs.202105084

PMCID:: PMC8895116

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Select item 96172154.

Open Hardware in Science: The Benefits of Open Electronics

Michael Oellermann, Jolle W Jolles, Diego Ortiz, Rui Seabra, Tobias Wenzel, Hannah Wilson, Richelle L Tanner

Integr Comp Biol. 2022 Oct; 62(4): 1061–1075. Published online 2022 May 20. doi: 10.1093/icb/icac043

PMCID:: PMC9617215

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Select item 96227015.

High-speed, scanned laser structuring of multi-layered eco/bioresorbable materials for advanced electronic systems

Quansan Yang, Ziying Hu, Min-Ho Seo, Yameng Xu, Ying Yan, Yen-Hao Hsu, Jaime Berkovich, Kwonjae Lee, Tzu-Li Liu, Samantha McDonald, Haolin Nie, Hannah Oh, Mingzheng Wu, Jin-Tae Kim, Stephen A. Miller, Ying Jia, Serkan Butun, Wubin Bai, Hexia Guo, Junhwan Choi, Anthony Banks, Wilson Z. Ray, Yevgenia Kozorovitskiy, Matthew L. Becker, Mitchell A. Pet, Matthew R. MacEwan, Jan-Kai Chang, Heling Wang, Yonggang Huang, John A. Rogers

Nat Commun. 2022; 13: 6518. Published online 2022 Oct 31. doi: 10.1038/s41467-022-34173-0

PMCID:: PMC9622701

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Select item 110201396.

Laser-Guided, Self-Confined Graphitization for High-Conductivity Embedded Electronics

Haiyang Yu, Jing Bian, Furong Chen, Kan Li, YongAn Huang

Research (Wash D C) 2024; 7: 0305. Published online 2024 Feb 12. doi: 10.34133/research.0305

PMCID:: PMC11020139

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Select item 100858667.

Skin-Interfaced Electronics: A Promising and Intelligent Paradigm for Personalized Healthcare

Yangzhi Zhu, Jinghang Li, Jinjoo Kim, Shaopei Li, Yichao Zhao, Jamal Bahari, Payam Eliahoo, Guanghui Li, Satoru Kawakita, Reihaneh Haghniaz, Xiaoxiang Gao, Natashya Falcone, Menekse Ermis, Heemin Kang, Hao Liu, HanJun Kim, Tanveer Tabish, Haidong Yu, Bingbing Li, Mohsen Akbari, Sam Emaminejad, Ali Khademhosseini

Biomaterials. Author manuscript; available in PMC 2024 May 1.

Published in final edited form as: Biomaterials. 2023 May; 296: 122075. Published online 2023 Mar 7. doi: 10.1016/j.biomaterials.2023.122075

PMCID:: PMC10085866

Article PDF–3.9M

Select item 84989138.

Wireless Soft Scalp Electronics and Virtual Reality System for Motor Imagery‐Based Brain–Machine Interfaces

Musa Mahmood, Shinjae Kwon, Hojoong Kim, Yun‐Soung Kim, Panote Siriaraya, Jeongmoon Choi, Boris Otkhmezuri, Kyowon Kang, Ki Jun Yu, Young C. Jang, Chee Siang Ang, Woon‐Hong Yeo

Adv Sci (Weinh) 2021 Oct; 8(19): 2101129. Published online 2021 Jul 17. doi: 10.1002/advs.202101129

PMCID:: PMC8498913

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Select item 61871449.

Conductively coupled flexible silicon electronic systems for chronic neural electrophysiology

Jinghua Li, Enming Song, Chia-Han Chiang, Ki Jun Yu, Jahyun Koo, Haina Du, Yishan Zhong, Mackenna Hill, Charles Wang, Jize Zhang, Yisong Chen, Limei Tian, Yiding Zhong, Guanhua Fang, Jonathan Viventi, John A. Rogers

Proc Natl Acad Sci U S A. 2018 Oct 9; 115(41): E9542–E9549. Published online 2018 Sep 18. doi: 10.1073/pnas.1813187115

PMCID:: PMC6187144

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Integrating Emerging Polymer Chemistries for the Advancement of Recyclable, Biodegradable, and Biocompatible Electronics

Jerika A. Chiong, Helen Tran, Yangju Lin, Yu Zheng, Zhenan Bao

Adv Sci (Weinh) 2021 Jul; 8(14): 2101233. Published online 2021 May 20. doi: 10.1002/advs.202101233

PMCID:: PMC8292855

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Select item 584888411.

Soft Material-Enabled, Flexible Hybrid Electronics for Medicine, Healthcare, and Human-Machine Interfaces

Robert Herbert, Jong-Hoon Kim, Yun Soung Kim, Hye Moon Lee, Woon-Hong Yeo

Materials (Basel) 2018 Feb; 11(2): 187. Published online 2018 Jan 24. doi: 10.3390/ma11020187

PMCID:: PMC5848884

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Select item 653908212.

Silver Nanoparticles Based Ink with Moderate Sintering in Flexible and Printed Electronics

Lixin Mo, Zhenxin Guo, Li Yang, Qingqing Zhang, Yi Fang, Zhiqing Xin, Zheng Chen, Kun Hu, Lu Han, Luhai Li

Int J Mol Sci. 2019 May; 20(9): 2124. Published online 2019 Apr 29. doi: 10.3390/ijms20092124

PMCID:: PMC6539082

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Select item 759408113.

Sensors Made of Natural Renewable Materials: Efficiency, Recyclability or Biodegradability—The Green Electronics

Benoît Piro, Hoang Vinh Tran, Vu Thi Thu

Sensors (Basel) 2020 Oct; 20(20): 5898. Published online 2020 Oct 19. doi: 10.3390/s20205898

PMCID:: PMC7594081

Article PDF–26M

Select item 887489714.

Plant Bioelectronics and Biohybrids: The Growing Contribution of Organic Electronic and Carbon-Based Materials

Gwennaël Dufil, Iwona Bernacka-Wojcik, Adam Armada-Moreira, Eleni Stavrinidou

Chem Rev. 2022 Feb 23; 122(4): 4847–4883. Published online 2021 Dec 20. doi: 10.1021/acs.chemrev.1c00525

PMCID:: PMC8874897

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Select item 986000615.

Recent Advances and Challenges Toward Application of Fibers and Textiles in Integrated Photovoltaic Energy Storage Devices

Amjid Rafique, Isabel Ferreira, Ghulam Abbas, Ana Catarina Baptista

Nanomicro Lett. 2023 Dec; 15: 40. Published online 2023 Jan 20. doi: 10.1007/s40820-022-01008-y

PMCID:: PMC9860006

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Select item 1001441516.

Soft Electronics for Health Monitoring Assisted by Machine Learning

Yancong Qiao, Jinan Luo, Tianrui Cui, Haidong Liu, Hao Tang, Yingfen Zeng, Chang Liu, Yuanfang Li, Jinming Jian, Jingzhi Wu, He Tian, Yi Yang, Tian-Ling Ren, Jianhua Zhou

Nanomicro Lett. 2023 Dec; 15: 66. Published online 2023 Mar 15. doi: 10.1007/s40820-023-01029-1

PMCID:: PMC10014415

Article PDF–38M

Select item 583008917.

Dissolution of Monocrystalline Silicon Nanomembranes and Their Use as Encapsulation Layers and Electrical Interfaces in Water-Soluble Electronics

Yoon Kyeung Lee, Prof. Ki Jun Yu, Enming Song, Dr. Amir Barati Farimani, Dr. Flavia Vitale, Dr. Zhaoqian Xie, Younghee Yoon, Yerim Kim, Andrew Richardson, Haiwen Luan, Yixin Wu, Dr. Xu Xie, Timothy H. Lucas, Prof. Kaitlyn Crawford, Prof. Yongfeng Mei, Prof. Xue Feng, Prof. Yonggang Huang, Prof. Brian Litt, Prof. Narayana R. Aluru, Prof. Lan Yin, Prof. John A. Rogers

ACS Nano. Author manuscript; available in PMC 2018 Dec 26.

Published in final edited form as: ACS Nano. 2017 Dec 26; 11(12): 12562–12572. Published online 2017 Dec 14. doi: 10.1021/acsnano.7b06697

PMCID:: PMC5830089

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Select item 887492018.

In Vivo Organic Bioelectronics for Neuromodulation

Magnus Berggren, Eric D. Głowacki, Daniel T. Simon, Eleni Stavrinidou, Klas Tybrandt

Chem Rev. 2022 Feb 23; 122(4): 4826–4846. Published online 2022 Jan 20. doi: 10.1021/acs.chemrev.1c00390

PMCID:: PMC8874920

Article PDF–14M

Select item 1045276019.

Electric Double Layer Based Epidermal Electronics for Healthcare and Human-Machine Interface

Yuan Gao, Hanchu Zhang, Bowen Song, Chun Zhao, Qifeng Lu

Biosensors (Basel) 2023 Aug; 13(8): 787. Published online 2023 Aug 3. doi: 10.3390/bios13080787

PMCID:: PMC10452760

Article PDF–14M

Select item 704766920.

Electronics Supply Chain Integrity Enabled by Blockchain

Xiaolin Xu, Fahim Rahman, Bicky Shakya, Apostol Vassilev, Domenic Forte, Mark Tehranipoo

ACM Transact Des Autom Electron Syst. Author manuscript; available in PMC 2020 Feb 28.

Published in final edited form as: ACM Transact Des Autom Electron Syst. 2019; 24(3): 10.1145/3315571. doi: 10.1145/3315571

PMCID:: PMC7047669

Article PDF–2.9M

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PMC Images search for electronic component

Figure 1

(a) Schematic image of electronic component mounting through contact pressure using an elastic adhesive; (b) electrode surface profiles of surface-mounted electronic component; (c) deformation of contact pad of metal layer of elastic adhesive sheet by gradually increasing contact pressure.

Resistance Change Mechanism of Electronic Component Mounting through Contact Pressure Using Elastic Adhesive

Micromachines (Basel). 2019 Jun;10(6):396.
FIGURE 3

The cumulative contribution rates of top several PCs of the E‐nose (a) and tongue (b) data matrixes for red wines identification. E‐nose, electronic nose; E‐tongue, electronic tongue; PC, principal component

Integration of a low‐cost electronic nose and a voltammetric electronic tongue for red wines identification

Food Sci Nutr. 2020 Aug;8(8):4330-4339.
FIGURE 3

Electronic nose, electronic tongue, and sensory evaluation analysis of raw and cooked scallops. (A) Principal component analysis of electronic nose results. (B) Radar graph of electronic nose results. (C) Principal component analysis of electronic tongue results. (D) Radar graph of sensory evaluation results (CK, the control group; BS, boiled sample; RS, oven heated sample; FS, fried sample; MS, microwaved sample).

Effects of four cooking methods on flavor and sensory characteristics of scallop muscle

Front Nutr. 2022;9:1022156.
Figure 4

Change in engine power due to electronic component failure (author).

Influence of Engine Electronic Management Fault Simulation on Vehicle Operation

Sensors (Basel). 2022 Mar;22(5):2054.